TongFu Microelectronics is a leading provider of semiconductor packaging and testing services. The company specializes in advanced chip assembly and complex testing procedures for global customers. With a strong focus on innovation, TongFu Microelectronics continues to drive progress in microelectronics.
Date confirmed from the official Chinese exchange disclosure timetable.
Pre-market — typically early morning before trading starts (around 7–8 a.m. CET).
TongFu Microelectronics A is scheduled to report its next quarterly earnings on 10/28/2026. Pre-market — typically early morning before trading starts (around 7–8 a.m. CET).
TongFu Microelectronics A last reported quarterly earnings on 8/26/2026 (Q2 2026). Earnings per share (EPS) came in at 0.25 CNY.
TongFu Microelectronics A has beaten analyst EPS estimates in 4 of its last 5 evaluated quarters (beat rate: 80%).
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Basis: 5 quarters with an analyst estimate and reported EPS.
Past price reactions are not a reliable indicator of future performance.